On-wafer microwave metrology for future industrial applications

In response to the global chip shortage caused by the COVID-19 pandemic, the EC launched the European Chips act with the aim of ensuring “Europe’s competitiveness and resilience in semiconductor technologies and applications”.
In areas such as the internet or telecommunications, higher radiofrequencies (RF) are being introduced (≥ 110 GHz) to support emerging technologies such as 6G and quantum computing. However, no calibration and measurements capabilities exist above 110 GHz. The semiconductor industry uses simulations to reduce time to market, and to validate high-frequency designs Vector Network Analysers (VNA) are employed. These provide information on the S-parameter, used to determine the properties or performance of RF components. New ‘single-sweep’ VNA systems are now being introduced for on-wafer measurements, but no traceability has existed for these systems.

Building on PlanarCal  and TEMMT this project will investigate three VNA methods to establish measurements up to 500 GHz. New technology including broadband single-sweep systems, Rydberg atom-based probes, artificial intelligence, and machine learning will be investigated, developed and used to improve the characterisation of semiconductor chips and devices used in RF products. Traceable methods and guides will be produced for specialised semiconductor technologies such as BiCMOS or Gallium Nitride up to at least 110 GHz, for which traceability currently does not exist. In addition, the project will develop new methods for material characterisation of semiconductors from 50 GHz to 500 GHz.

The new measurements and facilities for RF electronic products will significantly strengthen competitiveness and growth of the of the semiconductor and telecommunication industries in Europe.