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Dielectric Measurements of Conventional and 3-D Printed Substrate Materials from 50 GHz to 1.5 THz Using Free-Space and TDS Methods

Shang X., Ausden L., Naftaly M., Ridler N., Feng D., Navarro-Cia M., Hales J., Premerlani R.
Keywords:

Dielectric measurement, free-space method, material characterization, millimeter-wave and THz, substrate materials, TDS

Document type Proceedings
Journal title / Source
Page numbers / Article number 717-720
Publisher's name IEEE
Publisher's address (city only) Piscataway
Publication date 2025-1-1
Conference name 2025 IEEE/MTT-S International Microwave Symposium
Conference date 15-20 June 2025
Conference place San Francisco, CA, USA
DOI 10.5281/zenodo.17429041

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Name of Call / Funding Programme
Metrology Partnership 2023: Industry