Reliability study of fiber-coupled photodiode module for operation at 4 K
Bardalen E., Karlsen B., Malmbekk H., Akram M.N., Ohlckers P.Optoelectronic packaging, Cryogenics, Voltage standards
| Document type | Article |
| Journal title / Source | Microelectronics Reliability |
| Volume | 81 |
| Issue | February 2 |
| Page numbers / Article number | 362-367 |
| Publisher's name | Elsevier BV |
| Publication date | 2018-2 |
| ISSN | 0026-2714 |
| DOI | 10.1016/j.microrel.2017.10.034 |
| Language | English |