Advanced VNA-based microwave on-wafer measurements for electronics and 6G communications

The European Chips Act aims to strengthen supply chain resilience and increase Europe’s market share in semiconductor devices from 10 % to 20 % by 2030. Emerging applications, including 6G telecommunications, automotive radar systems, and satellite-based sensing for climate monitoring, are increasingly utilising the millimetre-wave (30 GHz – 300 GHz) and sub-terahertz (300 GHz – 3 THz) frequencies. However, there is currently a lack of SI traceability at these frequencies for the S-parameter (scattering parameter), measured using Vector Network Analysers (VNA). The S-parameter describes how high-frequency signals, in terms of amplitude and phase, propagate through an electrical network by measuring the ratio of reflected and transmitted voltage waves to incident waves. This includes measurements for novel “on-chip” antennas used in 6G, or differential circuits and complex multiport chips that can handle high-frequency signals or integrate multiple devices into a single hub. These frequencies can also generate “microwave noise” affecting the signal level that transistors, amplifiers, receivers, and similar devices can process.

Building on PlanarCal, TEMMT and OnMicro, this project will establish the first traceability and verification techniques for S-parameter measurements for on-wafer 6G antennas up to 330 GHz and demonstrated these through interlaboratory comparisons. It will also provide the first traceability for both multiport and differential circuits and establish capability for on-wafer noise measurements up to frequencies of at least 110 GHz. As integrated circuits can generate heat, it will also put in place measurement traceability for substate materials up to 150^oC at frequencies of at least 220 GHz.

The knowledge gained will be used to draft good practice guidelines in this area, supporting both the introduction of 6G and other emerging technologies, and help Europe meet its semiconductor goals.