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Interlaboratory mmWave and THz Quasi-Optical Characterization of Commercial Conventional and 3-D Printable Substrates

Sari A., Premerlani R., Hales J., Constantinou C., Gunn J., Ridler N., Naftaly M., Ausden L., Shang X., Trilk J., Brown M., Feng D., Navarro-Cía M.
Keywords:

3D printable substrates, extraction algorithm, material characterization, roughness, terahertz (THz), time-domain spectroscopy (TDS), vector network analyzer (VNA)

Document type Article
Journal title / Source IEEE Transactions on Terahertz Science and Technology
Volume 16
Issue 6
Page numbers / Article number 737-749
Publisher's name Institute of Electrical and Electronics Engineers (IEEE)
Publisher's address (city only) Piscataway, NJ, United States
Publication date 2026-1-1
ISSN 2156-342X,2156-3446
DOI 10.1109/TTHZ.2026.3674230

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Name of Call / Funding Programme
Metrology Partnership 2023: Industry