Provisional Assessment of Candidate High-Temperature Thermal Conductivity Reference Materials in the EMRP “Thermo” Project

Wu J., Morrell R., Fry T., Gnaniah S., Dohil D., Dawson A., Hameury J., Koenen A., Hammerschmidt U., Turzó-András E., Strnad R., Blahut A.

thermal conductivity, reference material, provisional assessment, high temperature, dimensional stability, mechanical stability, chemical stability, uniformity

Document type Proceedings
Journal title / Source 32nd International Thermal Conductivity Conference and 20th International Thermal Expansion Symposium
Peer-reviewed article 1
Volume N/A
Issue N/A
Page numbers / Article number 142-153
Publisher's name Purdue University Press
Publisher's address (city only) West Lafayette, IN, USA
Publication date 2015
Conference name 32nd International Thermal Conductivity Conference
Conference date Apr. 27 - May 1, 2014
Conference place Purdue University, West Lafayette, Indiana, USA
DOI 10.5703/1288284315555
ISBN Print ISBN: 978-1-62671-050-4; ePUB ISBN: 978-1-62671-051-1; ePDF ISBN: 978-1-62671-052-8
Language English

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