Provisional Assessment of Candidate High-Temperature Thermal Conductivity Reference Materials in the EMRP “Thermo” Project
Wu J., Morrell R., Fry T., Gnaniah S., Dohil D., Dawson A., Hameury J., Koenen A., Hammerschmidt U., Turzó-András E., Strnad R., Blahut A.thermal conductivity, reference material, provisional assessment, high temperature, dimensional stability, mechanical stability, chemical stability, uniformity
| Document type | Proceedings |
| Journal title / Source | 32nd International Thermal Conductivity Conference and 20th International Thermal Expansion Symposium |
| Peer-reviewed article | 1 |
| Volume | N/A |
| Issue | N/A |
| Page numbers / Article number | 142-153 |
| Publisher's name | Purdue University Press |
| Publisher's address (city only) | West Lafayette, IN, USA |
| Publication date | 2015 |
| Conference name | 32nd International Thermal Conductivity Conference |
| Conference date | Apr. 27 - May 1, 2014 |
| Conference place | Purdue University, West Lafayette, Indiana, USA |
| ISSN | N/A |
| DOI | 10.5703/1288284315555 |
| ISBN | Print ISBN: 978-1-62671-050-4; ePUB ISBN: 978-1-62671-051-1; ePDF ISBN: 978-1-62671-052-8 |
| Web URL | http://docs.lib.purdue.edu/thermal/2014/steady/5/ |
| Language | English |