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Measurement-Based Signal Integrity Analysis of Coupled Thin-Film Microstrip Lines

Pham T. D., Allal D., Chiariello A. G. , Maffucci G., Miele G., Di Capua G., Lahbacha K.
Keywords:

Signal Integrity, Thin film, TFMSL, SU-8, Transmissions, Reflections, Eye-diagrams, Data rate

Document type Proceedings
Journal title / Source 2024 IEEE International Symposium on Measurements & Networking proceedings
Publication date 2024-8
Conference name 2024 IEEE International Symposium on Measurements & Networking
Conference date 02-07-2024 to 05-07-2024
Conference place Rome, Italy
DOI 10.5281/zenodo.13838741
Language English

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Information

Name of Call / Funding Programme
EMPIR 2020: Industry