Measurement and Analysis of On-Wafer Test Structures for Signal Integrity Assessment at Chip Level
Miele G., Maffucci A., Lahbacha K., Phung G. N., Pham T. D., Arz U., Allal D.Thin film, TFMSL, SU-8, Signal Integrity, SI, Power Integrity, PI, FPGA, test structures
| Document type | Proceedings |
| Journal title / Source | 2024 Conference on Precision Electromagnetic Measurements Proceedings |
| Publication date | 2024-8-30 |
| Conference name | 2024 Conference on Precision Electromagnetic Measurements |
| Conference date | 08-07-2024 to 12-07-2024 |
| Conference place | Denver, CO, USA |
| DOI | 10.5281/zenodo.13838882 |
| Language | English |