Guidelines for the Design of Thin Film Microstrip Lines for Signal Integrity Analysis
Lahbacha K., Phung G. N., Pham T. D., Arz U., Di Capua G., Maffucci A., Miele G., Allal D.Transmission line measurements, Integrated circuit modeling, Substrates, Scattering parameters, Calibration, Uncertainty, Signal integrity, Analytical models, Probes, Microstrip
| Document type | Article |
| Journal title / Source | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Publication date | 2024-10 |
| DOI | 10.1109/TCPMT.2024.3473533 |
| Language | English |