Signal Integrity Analysis of Coupled Thin-Film Microstrip Lines (TFMSLs)
Lahbacha K., Di Capua G., Miele G., Maffucci A., Pham T.D, Allal D., Phung G.N, Arz U.crosstalk, data rate, Signal Integrity, insertion loss, jitter, TFMSL
| Document type | Proceedings |
| Journal title / Source | 2023 IEEE 27th Workshop on Signal and Power Integrity (SPI) proceedings |
| Publication date | 2023-6-12 |
| Conference name | 2023 IEEE 27th Workshop on Signal and Power Integrity (SPI) |
| Conference date | 07-05-2023 to 10-05-2023 |
| Conference place | Aveiro, Portugal |
| DOI | 10.5281/zenodo.10548983 |
| Web URL | https://ieeexplore.ieee.org/document/10145525 |
| Language | English |