Packaging of fiber-coupled module for Josephson junction array voltage standards

Kieler O., Malmbekk H., Tuan Nguyen T.A., Bardalen E., Ohlckers P.

Optical fibers, Photodiodes, Silicon, Cryogenics, Bonding, Stress, Flip-chip devices

Document type Article
Journal title / Source 2016 Conference on Precision Electromagnetic Measurements (CPEM 2016)
Publisher's name IEEE
Publication date 2016-7
DOI 10.1109/CPEM.2016.7540561
Language English

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