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Packaging of fiber-coupled module for Josephson junction array voltage standards

Kieler, O., Malmbekk, H., Tuan Nguyen, T.A. (HBV), Bardalen, E. (HBV) and Ohlckers, P.
Keywords:

Optical fibers, Photodiodes, Silicon, Cryogenics, Bonding, Stress, Flip-chip devices

Document typeArticle
Journal title / Source2016 Conference on Precision Electromagnetic Measurements (CPEM 2016)
Publisher's nameIEEE
Publication date 2016-07
DOI10.1109/CPEM.2016.7540561
LanguageEnglish

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