A deep etching mechanism for trenchbridging silicon nanowires
Tasdemir Z., Wollschläger N., Österle W., Leblebici Y., Erdem Alaca B.silicon nanowire, deep reactive ion etching, transmission electron microscopy, MEMS & NEMS
Document type | Article |
Journal title / Source | Nanotechnology |
Peer-reviewed article | 1 |
Volume | 27 (2016) 095303 |
Issue | 2016 |
Page numbers / Article number | 8 pp |
Publisher's name | IOP Publishing Ltd. |
Publisher's address (city only) | London |
Publication date | 2016-2-8 |
DOI | 10.1088/0957-4484/27/9/095303 |
Language | English |