A deep etching mechanism for trenchbridging silicon nanowires

Tasdemir Z., Wollschläger N., Österle W., Leblebici Y., Erdem Alaca B.

silicon nanowire, deep reactive ion etching, transmission electron microscopy, MEMS & NEMS

Document type Article
Journal title / Source Nanotechnology
Peer-reviewed article 1
Volume 27 (2016) 095303
Issue 2016
Page numbers / Article number 8 pp
Publisher's name IOP Publishing Ltd.
Publisher's address (city only) London
Publication date 2016-2-8
DOI 10.1088/0957-4484/27/9/095303
Language English

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