RF Measurements for future communications applications

Short Name: FutureCom, Project Number: 20IND03

Developing the measurement capability for future communication networks in Europe

Smart city with communication network

The EU’s digital strategy targets a climate-neutral Europe by 2050. However, the advent of new technologies, including autonomous cars or 5G networks, require the utilisation of higher frequency transmissions and broader bandwidths. If applied to present electronic radio frequency (RF) instrumentation this would result in increased energy consumption. In future electronic networks will require devices capable of improved energy and operational efficiency. However, no measurement facilities exist in Europe for assessing the real-world performance of component-dense types of instrumentation including ‘Passive Inter-Module’ effects, which can occur in the high-power industry-grade connectors used in 5G networks. If not addressed this will have a negative effect on manufacturers of RF products and the communications sector as a whole.

 

Building on the EURAMET projects HFCircuits and ADVENT, FutureComm developed techniques to characterise electronics operating at higher (mm) wavelength frequencies, including electronic chips with integrated antennas. It also evaluated signal and power integrity as well as electromagnetic interference (EMI) in high speed digital circuits, ensuring operation as designed. Devices were also assessed under real-world operating conditions and harsh environmental influences, such as those found in orbital satellites. New methodology was also developed to measure the detrimental effects caused by high component density.

These new capabilities, disseminated through good practice guides, workshops, publications and input into international standards will strengthen Europe’s positions in the communication and electronics sectors. Reduced overall energy consumption will also help attain the climate neutral goal by 2050.

 

S-Parameter Bilateral Comparison in 4.3-10 Coaxial Line
2024

Proceedings of 2024 Conference on Precision Electromagnetic Measurements

Characterisation of power transistors for wireless network applications using passive and active load-pull
2024

2024 IEEE International Symposium on Measurements & Networking proceedings

Temperature Humidity Bias Testing of a Wafer-Embedded Coplanar Waveguide Line up to 40 GHz
2024

2024 103rd ARFTG Microwave Measurement Conference Proceedings

Measurement of Passive Intermodulation with Uncertainty Budget using a Vectorial-PIM System
2024

2024 IEEE International Symposium on Measurements & Networking proceedings

Measurement-Based Signal Integrity Analysis of Coupled Thin-Film Microstrip Lines
2024

2024 IEEE International Symposium on Measurements & Networking proceedings

S-Parameter Analysis of Age Testing Effects on FR4-Based Printed Circuit Boards up to 10 GHz
2024

2024 IEEE International Symposium on Measurements & Networking proceedings

A Simplified Setup for Passive Intermodulation Measurement
2024

2024 IEEE International Instrumentation and Measurement Technology Conference Proceedings

Models and Methods for the Analysis of PCB Crosstalk in Switch-Mode Power Supplies
2024

2024 IEEE 28th Workshop on Signal and Power Integrity proceedings

Measurement and Analysis of On-Wafer Test Structures for Signal Integrity Assessment at Chip Level
2024

2024 Conference on Precision Electromagnetic Measurements Proceedings

A Fast High Sensitivity Power Transfer Device Approach for (sub)mm-wave applications
2024

A Fast High Sensitivity Power Transfer Device Approach for (sub)mm-wave applications

Guidelines for the Design of Thin Film Microstrip Lines for Signal Integrity Analysis
2024

IEEE Transactions on Components, Packaging and Manufacturing Technology

Impedance Standard Substrate Characterization and EM model definition for Cryogenic and Quantum-Computing Applications
2023

mpedance Standard Substrate Characterization and EM model definition for Cryogenic and Quantum-Computing Applications

Precise Modeling of Coplanar Device Measurements Under Realistic Conditions up to G-Band
2023

IEEE Transactions on Components, Packaging and Manufacturing Technology

Reduced Calibration Error Employing Parametrized EM models and DC Load Extraction
2023

Reduced Calibration Error Employing Parametrized EM models and DC Load Extraction

Uncertainty Budget in Microwave High-Power Testing
2023

IEEE Transactions on Instrumentation and Measurement

Signal Integrity Analysis of Coupled Thin-Film Microstrip Lines (TFMSLs)
2023

2023 IEEE 27th Workshop on Signal and Power Integrity (SPI) proceedings

Recommendations for the Design of Differential Thin-Film Microstrip Lines
2023

2023 IEEE 27th Workshop on Signal and Power Integrity (SPI) proceedings

D-Band Characterization of a Commercial High-Resistivity Silicon Calibration Substrate
2023

2023 101st ARFTG Microwave Measurement Conference (ARFTG) proceedings

RF Measurements for Future Communication Applications: an Overview
2022

2022 IEEE International Symposium on Measurements & Networking (M&N) proceedings

Participating EURAMET NMIs and DIs

CMI (Czechia)

IMBiH (Bosnia and Herzegovina)

INTA (Spain)

LNE (France)

METAS (Switzerland)

NPL (United Kingdom)

PTB (Germany)

UME (Türkiye)

VSL (Netherlands)

Other Participants

Anritsu Emea Limited (United Kingdom)
Fachhochschule Aachen (Germany)
INEX Microtechnology Limited (United Kingdom)
Keysight Technologies Belgium (Belgium)
National Instruments Belgium NV (Belgium)
Nokia Solutions And Networks GmbH & Co. KG (Germany)
Rosenberger Hochfrequenztechnik GmbH & Co. KG (Germany)
Technische Universiteit Delft (Netherlands)
THALES (France)
Università degli Studi di Cassino e del Lazio Meridionale (Italy)
University of Surrey (United Kingdom)

Information

Programme
EMPIR
Field
Industry
Status
completed
Call
2020
Duration
2021-2024
Project website