Provisional Assessment of Candidate High-Temperature Thermal Conductivity Reference Materials in the EMRP “Thermo” Project
Wu J., Morrell R., Fry T., Gnaniah S., Dohil D., Dawson A., Hameury J., Koenen A., Hammerschmidt U., Turzó-András E., Strnad R., Blahut A.thermal conductivity, reference material, provisional assessment, high temperature, dimensional stability, mechanical stability, chemical stability, uniformity
Document type | Proceedings |
Journal title / Source | 32nd International Thermal Conductivity Conference and 20th International Thermal Expansion Symposium |
Peer-reviewed article | 1 |
Volume | N/A |
Issue | N/A |
Page numbers / Article number | 142-153 |
Publisher's name | Purdue University Press |
Publisher's address (city only) | West Lafayette, IN, USA |
Publication date | 2015 |
Conference name | 32nd International Thermal Conductivity Conference |
Conference date | Apr. 27 - May 1, 2014 |
Conference place | Purdue University, West Lafayette, Indiana, USA |
ISSN | N/A |
DOI | 10.5703/1288284315555 |
ISBN | Print ISBN: 978-1-62671-050-4; ePUB ISBN: 978-1-62671-051-1; ePDF ISBN: 978-1-62671-052-8 |
Web URL | http://docs.lib.purdue.edu/thermal/2014/steady/5/ |
Language | English |