Testing the mechanical characteristics and contacting behavior of novel manufactured and assembled sphere-tipped styli for micro-CMM probes
Sheu D-Y, Claverley J D, Leach R Kmicro-CMM, sphere tipped stylus, assembly, gluing process, WEDG, micro-EDM
Document type | Proceedings |
Journal title / Source | Precision Assembly Technologies and Systems |
Volume | 435 |
Page numbers / Article number | 15-21 |
Publication date | 2014 |
Conference name | International Precision Engineering Seminar |
Conference date | 13-19 Feb 2014 |
Conference place | Chamonix, France |
ISSN | 978-3-662-45585-2 |
DOI | 10.1007/978-3-662-45586-9_3 |
Web URL | http://link.springer.com/chapter/10.1007%2F978-3-662-45586-9_3 |