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Reliability study of fiber-coupled photodiode module for operation at 4 K

Bardalen, E. (HBV), Karlsen, B., Malmbekk, H., Akram, M.N. and Ohlckers, P.
Keywords:

Optoelectronic packaging, Cryogenics, Voltage standards

Document typeArticle
Journal title / SourceMicroelectronics Reliability
Volume81
IssueFebruary 2
Page numbers / Article number362-367
Publisher's nameElsevier BV
Publication date 2018-02
ISSN0026-2714
DOI10.1016/j.microrel.2017.10.034
LanguageEnglish

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