Reliability study of fiber-coupled photodiode module for operation at 4 K
Bardalen E., Karlsen B., Malmbekk H., Akram M.N., Ohlckers P.Optoelectronic packaging, Cryogenics, Voltage standards
Document type | Article |
Journal title / Source | Microelectronics Reliability |
Volume | 81 |
Issue | February 2 |
Page numbers / Article number | 362-367 |
Publisher's name | Elsevier BV |
Publication date | 2018-2 |
ISSN | 0026-2714 |
DOI | 10.1016/j.microrel.2017.10.034 |
Language | English |