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A deep etching mechanism for trenchbridging silicon nanowires

Tasdemir, Z. (KOC University, Istanbul, Turkey), Wollschläger, N. (BAM, Berlin, D), Österle, W. (BAM, Berlin, D), Leblebici, Y. (EPFL, Lausanne, CH) and Erdem Alaca, B. (KOC University, Istanbul, Turkey)
Keywords:

silicon nanowire, deep reactive ion etching, transmission electron microscopy, MEMS & NEMS

Document typeArticle
Journal title / SourceNanotechnology
Peer-reviewed articleYes
Volume27 (2016) 095303
Issue2016
Page numbers / Article number8 pp
Publisher's nameIOP Publishing Ltd.
Publisher's address (city only)London
Publication date 2016-02-8
DOI10.1088/0957-4484/27/9/095303
LanguageEnglish

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